Phenol-biphenyl epoxy resin

A high-performance epoxy resin with a biphenyl backbone introduced into its molecules, combining the rigidity of biphenyl with the high reactivity of epoxy groups. The product exhibits ultra-high heat resistance, an extremely low coefficient of thermal expansion (CTE), excellent thermal stability, and high modulus. It is primarily used in high-end semiconductor packaging, high-performance copper clad laminates, and electronic components with extremely high reliability requirements.