Phenol biphenyl epoxy resin

简介概述

A high-performance epoxy resin that introduces a biphenyl skeleton into its molecules, combining the rigidity of biphenyl with the high reactivity of epoxy groups. The product has ultra-high heat resistance, extremely low coefficient of thermal expansion (CTE), excellent thermal stability, and high modulus. It is mainly used for high-end semiconductor packaging, high-performance copper-clad laminates, and electronic components with extremely high reliability requirements.

详细参数

Grade	Epoxy equivalent g/eq	Viscosity P/150°C	Softening point ℃	Feature
Eziure™6000	265-285	0.4-1.1	53-63	Low water absorption. High heat resistance. Excellent toughness.
Eziure™6000L	261-282	0. 1-0.7	45-60
Eziure™6000H	280-300	2.5-4.5	65-75

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